i am planning to use aerial EZ-DCE15 for my raspberry pi 3 model b + ic880a LORAWAN gateway.
It would be mounted outside with ambient temperatures ranging between -5 to 50 celcius. Would this be a good fit to protect the PCB’s from heat, moisture and dust ?
I have a handful of these and they look & work fine- - believe originally developed for external/ruggedized CCTV & CATV repeaters/Jn boxes etc… Using for both RPi & 880 & RAK 831 implementations as well as rehousing other GW boards to provide outdoor units. E-Zy is a Taiwanese brand (IIRC) and if you find space tight they have a range of cases inc a square unit ( EZ-SOE01W - think Aerial occasionally have stock or can get for you as well as seen on AMZN, etc. GIYF) with flanges vs hinged (but smooth grey coated aluminium vs ribbed bare metal) that is a bit bigger and provided ~50% more internal volume for adding other circuitry (PoE adapters, monitor nodes/sensors, back-up battery etc.)
I went to http://www.e-zy.net but there is no buy option for EZ-SOE01W.
you think, these would be great for heat, dust and moisture ?
are the uv coated ?
@Jeff-UK
raspberry pi with RAK converted board along with RAK 831 concentrator, sitting on top of each other, will this fit inside the EZ-DCE15 ? will there be room to put in a heat sink ? It would be great if you can share your outdoor RAK 831 setup.
I went to http://www.e-zy.net ](http://www.e-zy.net/) but there is no buy option for EZ-SOE01W.
@myttndel Sorry but dont have a built unit to hand at the moment (all in the field!) But quickly threw a few components waiting next build into case to give you some idea of scale and space. In this case its Pi with RAK831 & RAK i/f board all mounted on a 3D printed raft to ease fixing to back baseplate. A build with ic880a would be approx similar in size depending on your choice of inter-poser board. If space tight for you you can remove this plate to gain a few mm extra depth. With this I have approx 1cm-1.5cm space to other side of case - you could perhaps look at (electrically insulated?) heat-sinking arrangement/gasket to take heat from the RF board to case, though I havent run into any heat problems so far. I build with either active or passive PoE feed, though also awaiting some small mains psu’s to test for on grid builds - would take space of the TP-Link unit here. There is even enough space to build in a small back-up battery for occasional short pwr outages.
Edit original 2nd pic was duplicate…correct open view! 
Note the cases ship in expanded polystyene packing which gets everywhere and worse still generates lots of static so dont open/unpack in proximity to sensitive electronics! Also as I take several at a time, when shipped together they rub and generate a build up which is held by the chassis and can give you a decent whack! 
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